镀液中Ce^3＋离子对锡镀层结构缺陷和可焊性的影响

应用荧光分析法、X光电子能谱法(XPS)及正电子湮没寿命谱法(PALS)等研究了从含硫酸铈添加剂的酸性光亮锡镀液获得的锡镀层结构缺陷与可焊性的关系。结果表明,电镀时Ce与Sn不发生共沉积,Ce~(3+)的主要作用是阻化Sn~(2+)的水解和氧化使镀液稳定,因而使锡镀层纯度提高、结构致密、表层氧含量减少,有利于提高镀层的可焊性。当Ce~(3+)浓度控制在3.5g/L左右时,可使镀层结构缺陷较少,可焊性较佳,说明结构缺陷是影响锡镀层可焊性的直接原因。     

丙烯酸酯接枝炭黑无皂水性涂料的性能研究

旋转粘度计研究了丙烯酸酯接枝炭黑无皂水性涂料的流变性能，并考察了着色涂料的冻融及贮存稳定性。接枝炭黑争散于无皂水性涂料中形成的着色涂料具有良好的综合性能。     

Synthesis of temperature-sensitive micron-sized monodispersed composite polymer particles and its application as a carrier for biomolecules

 Temperature-sensitive micron-sized monodispersed composite polymer particles were prepared by seeded copolymerization of dimethylaminoethyl methacrylate and ethylene glycol dimethacrylate with 1.77 μm-sized monodispersed polystyrene seed particles. The change in surface property at temperature above and below 35 °C was examined by differential scanning calorimetry, trypsin activity and the adsorption/ desorption behaviors of low molecular weight cationic emulsifier as well as biomolecules. Received: 6 August 1997 Accepted: 16 January 1998     

计算单向复合材料弹性模量的新公式

根据复合材料单层的实际构造，提出了串并联组合模型，采用微观力学与宏观力学相结合的方法，推导出一组计算单向复合材料弹性模量的新公式。其优点是：Ｅ１和ｖ（１２）、Ｅ２和Ｇ（１２）的计算式形式对称，结构简单，计算容易，物理意义明确。我们把由世界上许多著名学者提出的多组预测公式和本文导出式计算所得的结果与国内外已发表的硼／环氧、碳／环氧、玻璃／环氧复合材料的实验数据相比较，结果表明：导出式比其他公式精确、更有价值，可供二程设计使用。     

硅藻土增强橡胶复合材料的研究进展

硅藻土是单细胞硅藻的遗骸经自然条件形成的硅质沉积岩,因其具有质轻、大的比表面积、超强的吸附性、隔音、耐磨、耐热以及耐腐蚀等特点而被广泛应用于化工、石油、建材、生物医药卫生以及环保等众多领域。然而由于硅藻土与白炭黑的结构成分相似,白炭黑通常用作橡胶的补强填料,目前硅藻土用于橡胶补强填料的研究鲜少报道。本文综述了硅藻土的性能、硅藻土的国内外研究现状、硅藻土的改性以及硅藻土增强橡胶复合材料的制备过程,并对硅藻土增强橡胶复合材料的发展趋势做了展望。     

聚苯胺复合材料研究进展

综述了聚苯胺/无机物复合材料和聚苯胺/有机高聚物复合材料的合成方法，性能特征，并展望了聚苯胺复合材料的研究，应用前景。     

Printed plastic electronics and paperlike displays

Plastic electronic materials and high‐resolution printing methods may be important technologies for new classes of consumer electronic devices that are lightweight, mechanically flexible and bendable, and that can cover large areas at low cost. This article summarizes some of our recent work in this area. It focuses on the materials and patterning techniques that we used to produce plastic active‐matrix backplane circuits for a type of paperlike display. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 3327–3334, 2002     

Keggin型杂多酸在镀锌钝化中的应用

比较了H_4SiMo_(12)O_(40)、H_3PW_(12)O_(40)、H_4SiW_(12)O_(40)、H_3PMo_(12)O_(40)及铬酸盐对镀锌层钝化效果。H_3PMo_(12)O_(40)钝化的最佳条件为:H_3PMo_(12)O_(40)5g/L,pH 1.1,钝化时间35秒,温度15℃,空留时间10秒,封闭温度100℃(水)。经扫描电镜、XPS、AES、IR和Raman光谱等测定,表明在锌表面形成了一种含有P、Mo、O及Zn的耐蚀性膜。其中钼以Mo(Ⅵ)、Mo(Ⅴ)和Mo(Ⅳ)存在,P/Mo比为1:3.0。推测锌表面形成了一种形如Zn_x(PMo_3)_rO_z/ZnO/Zn的复杂钝化膜。     

SBS单组分橡胶防水涂料

探讨了SBS单组分橡胶防水涂料的组成、制备方法及其对性能的影响因素,详细地介绍了该涂料在防水工程应用上的两大独特优势:(1)优异的抗基层形变能力。这一优势,使其具备了屋面防水专用材料和特效材料的条件,解决了以往防水材料一直不能解决的“零点开裂”问题。(2)创造出多种复合防水工法,既克服和解决了卷材与涂料的各自缺点,又发挥了各自的优点,使这种复合防水层成为最有效的防水层。     

Fabrication and Properties of Conducting Polypyrrole/SWNT‐PABS Composite Films and Nanotubes

We report the electropolymerization and characterization of polypyrrole films doped with poly(m‐aminobenzene sulfonic acid (PABS) functionalized single‐walled nanotubes (SWNT) (PPy/SWNT‐PABS). The negatively charged water‐soluble SWNT‐PABS served as anionic dopant during the electropolymerization to synthesize PPy/SWNT‐PABS composite films. The synthetic, morphological and electrical properties of PPy/SWNT‐PABS films and chloride doped polypyrrole (PPy/Cl) films were compared. Characterization was performed by cyclic voltammetry, atomic force microscopy (AFM), scanning electron microscopy (SEM) and Raman spectroscopy. SEM and AFM images revealed that the incorporation of SWNT‐PABS significantly altered the morphology of the PPy. Cyclic voltammetry showed improved electrochemical properties of PPy/SWNT‐PABS films as compared to PPy/Cl films. Raman Spectroscopy confirmed the presence of SWNT‐PABS within composite films. Field effect transistor (FET) and electrical characterization studies show that the incorporation of the SWNT‐PABS increased the electronic performance of PPy/SWNT‐PABS films when compared to PPy/Cl films. Finally, we fabricated PPy/SWNT‐PABS nanotubes which may lead to potential applications to sensors and other electronic devices.